Vertical-type memory device

ABSTRACT

A vertical-type memory device includes a plurality of gate electrode layers spaced apart from one another and stacked on a substrate, and extending by different lengths in a first direction and forming a staircase structure, a first interlayer insulating layer covering the staircase structure of the plurality of gate electrode layers, and a plurality of gate contact plugs penetrating the interlayer insulating layer and respectively in contact with the gate electrode layers. The plurality of gate electrode layers include lower gate electrode layers disposed adjacently to the substrate, and upper gate electrode layers disposed on the lower gate electrode layers, so that the lower gate electrodes are between the substrate and the upper gate electrode layers. The plurality of gate contact plugs include lower gate contact plugs connected to the lower gate electrode layers, and upper gate contact plugs connected to the upper gate electrode layers. The upper gate contact plugs have top-most portions disposed at a height higher than a height of top surfaces of the lower gate contact plugs.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to Korean Patent Application No.10-2018-0114033 filed on Sep. 21, 2018 in the Korean IntellectualProperty Office, the disclosure of which is herein incorporated byreference in its entirety.

BACKGROUND 1. Field

Example embodiments of the present inventive concept relate to avertical-type memory device.

2. Description of Related Art

Electronic products have consistently been reduced in size and designedto process high capacity data. Accordingly, it has been helpful toincrease integration density of a semiconductor memory device used inelectronic products. To increase integration density of a semiconductormemory device, a vertical-type memory device in which memory cellshaving a vertical-type transistor structure, rather than a generalplanar transistor structure, are stacked has been developed.

SUMMARY

According to an example embodiment of the present inventive concept, avertical-type memory device includes a plurality of gate electrodelayers spaced apart from one another and stacked on a substrate, andextending by different lengths in a first direction and forming astaircase structure, a first interlayer insulating layer covering thestaircase structure of the plurality of gate electrode layers, and aplurality of gate contact plugs penetrating the interlayer insulatinglayer and respectively in contact with the gate electrode layers. Theplurality of gate electrode layers include lower gate electrode layersdisposed adjacently to the substrate, and upper gate electrode layersdisposed on the lower gate electrode layers, so that the lower gateelectrodes are between the substrate and the upper gate electrodelayers. The plurality of gate contact plugs include lower gate contactplugs connected to the lower gate electrode layers, and upper gatecontact plugs connected to the upper gate electrode layers. The uppergate contact plugs have top-most portions disposed at a height higherthan a height of top surfaces of the lower gate contact plugs.

According to an example embodiment of the present inventive concept,which may include the features of the above example embodiment, avertical-type memory device includes a memory cell region including aplurality of gate electrode layers spaced apart from one another andvertically stacked on the substrate, and a plurality of gate contactplugs respectively contacting the plurality of gate electrode layers.The plurality of gate contact plugs include a first gate contact plugcontacting a lowermost gate electrode layer among the plurality of gateelectrode layers, and a second gate contact plug contacting an uppermostgate electrode layer among the plurality of gate electrode layers, andthe first gate contact plug has a top surface having a first heightlower than a second height of a top-most surface of the second gatecontact plug. The first gate contact plug is integrally formed of acontinuous material to extend from the lowermost gate electrode layer toa height above the uppermost gate electrode layer, and the second gatecontact plug is integrally formed of a continuous material to extendfrom the uppermost gate electrode layer to the second height.

According to an example embodiment of the present inventive concept,which may include the features of the above example embodiments, avertical-type memory device includes a lower substrate, circuit devicesprovided on the lower substrate, a lower interlayer insulating layercovering the circuit devices, an upper substrate disposed on the lowerinterlayer insulating layer, a first gate electrode layer and a secondgate electrode layer spaced apart from each other and stacked on theupper substrate, an upper interlayer insulating layer covering the firstgate electrode layer and the second gate electrode layer, a first gatecontact plug and a second gate contact plug penetrating through theupper interlayer insulating layer and respectively contacting the firstgate electrode layer and the second gate electrode layer, and a throughplug penetrating through the first and second gate electrode layers andthe upper substrate and electrically connected to the circuit devices.The first gate contact plug and the through plug have top surfaceshaving heights lower than a height of a top-most portion of the secondgate contact plug.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentinventive concept will be more clearly understood from the followingdetailed description, taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a schematic block diagram illustrating a semiconductor deviceaccording to an example embodiment of the present inventive concept;

FIG. 2 is a diagram illustrating an equivalent circuit of a cell arrayof a semiconductor device according to an example embodiment of thepresent inventive concept;

FIG. 3 is a schematic plan diagram illustrating a semiconductor deviceaccording to an example embodiment of the present inventive concept;

FIG. 4 is a schematic cross-sectional diagram illustrating asemiconductor device, taken along line I-I′ in FIG. 3, according to anexample embodiment of the present inventive concept;

FIG. 5 is a cross-sectional diagram illustrating region “A” in FIG. 4 inmagnified form;

FIG. 6 is a diagram illustrating a channel structure (CHS) in FIG. 4;

FIG. 7 is a schematic cross-sectional diagram illustrating asemiconductor device, taken along line II-II′ in FIG. 3, according to anexample embodiment of the present inventive concept;

FIG. 8 is a schematic cross-sectional diagram illustrating asemiconductor device, taken along line III-III′ in FIG. 3, according toan example embodiment of the present inventive concept;

FIG. 9 is a cross-sectional diagram illustrating a pad region of asemiconductor device according to an example embodiment of the presentinventive concept;

FIG. 10 is a schematic cross-sectional diagram illustrating asemiconductor device, corresponding to FIG. 4, according to an exampleembodiment of the present inventive concept;

FIG. 11 is a cross-sectional diagram illustrating region “A” in FIG. 10in magnified form;

FIG. 12 is a schematic cross-sectional diagram illustrating asemiconductor device, corresponding to FIG. 7, according to an exampleembodiment of the present inventive concept;

FIG. 13 is a schematic cross-sectional diagram illustrating asemiconductor device according to an example embodiment of the presentinventive concept;

FIG. 14 is a schematic cross-sectional diagram illustrating asemiconductor device according to an example embodiment of the presentinventive concept;

FIG. 15 is a cross-sectional diagram illustrating region “B” in FIG. 14in magnified form;

FIGS. 16 to 20 are schematic cross-sectional diagrams illustrating amethod of manufacturing a semiconductor device according to an exampleembodiment of the present inventive concept.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present inventive concept will bedescribed as follows with reference to the accompanied drawings.

FIG. 1 is a schematic block diagram illustrating a semiconductor deviceaccording to an example embodiment. As described herein, a semiconductordevice may refer, for example, to a device such as a semiconductor chip(e.g., memory chip and/or logic chip formed on a die), a stack ofsemiconductor chips, a semiconductor package including one or moresemiconductor chips stacked on a package substrate, or apackage-on-package device including a plurality of packages. Thesedevices may include memory devices such as volatile or non-volatilememory devices.

Referring to FIG. 1, a semiconductor device 1 may include a memory cellarray 2 and a peripheral circuit 3. The peripheral circuit 3 may includea row decoder 4, a page buffer 5, an input and output buffer 6, acontrol logic 7, and a voltage generator 8.

The memory cell array 2 may include a plurality of memory blocks, andeach of the memory blocks may include a plurality of memory cells. Theplurality of memory cells may be connected to the row decoder 4 througha string selection line SSL, word lines WL, and a ground selection lineGSL, and may be connected to the page buffer 5 through bit lines BL. Inthe example embodiments, a plurality of memory cells arranged in thesame row may be connected to the same word line WL, and the plurality ofmemory cells arranged in the same column may be connected to the samebit line BL.

The row decoder 4 may decode an input address ADDR, and may generate andtransfer driving signals of the word line WL. The row decoder 4 mayprovide a word line voltage generated by the voltage generator 8 toselected word lines WL and non-selected word lines WL in response to acontrol of the control logic 7.

The page buffer 5 may be connected to the memory cell array 2 throughthe bit line BL, and may read out information stored in the memorycells. The page buffer 5 may temporarily store data to be stored in thememory cells or may sense data stored in the memory cells depending onoperational modes. The page buffer 5 may include a column decoder and asense amplifier. The column decoder may selectively activate the bitlines BL of the memory cell array 2, and the sense amplifier may sense avoltage of the bit line BL selected by the column decoder and read outdata stored in the selected memory cell during a reading operation.

Once a program operates, the input and output buffer 6 may receive dataDATA and transfer the data DATA to the page buffer 5, and during areading operation, the input and output buffer 6 may output the dataDATA transferred from the page buffer 5 to an external entity. The inputand output buffer 6 may transfer an input address or an input command tothe control logic 7.

The control logic 7 may control operations of the row decoder 4 and thepage buffer 5. The control logic 7 may receive a control signal and anexternal voltage transferred from an external entity, and may operate inresponse to the received control signal. The control logic 7 may controla reading operation, a writing operation, and/or an erasing operation inresponse to the control signals.

The voltage generator 8 may generate voltages for internal operations,such as a programming voltage, a reading voltage, an erasing voltage,and the like, using an external voltage. The voltage generated by thevoltage generator 8 may be transferred to the memory cell array 2through the row decoder 4.

FIG. 2 is a diagram illustrating an equivalent circuit of a cell arrayof a semiconductor device according to an example embodiment.

Referring to FIG. 2, a memory cell array 2 may include memory cells MCconnected to each other in series, a ground selection transistor GSTconnected to both ends of the memory cells MC in series, and a pluralityof memory cell strings S including string selection transistors SST1 andSST2. The plurality of memory cell strings S may respectively beconnected to bit lines BL0 to BL2 in parallel. The plurality of memorycell strings S may be connected to a common source line CSL in common.For example, the plurality of memory cell strings S may be disposedbetween the plurality of bit lines BL0 to BL2 and a single common sourceline CSL. In an example embodiment, the common source line CSL isconfigured such that a plurality of the common source lines CSL arearranged two-dimensionally.

The memory cells MC, connected to each other in series, may becontrolled by word lines WL0 to WLn for selecting the memory cells MC.Each of the memory cells MC may include a data storage factor. Gateelectrodes of the memory cells MC disposed the same distance from thecommon source line CSL may be connected to one of the word lines WL0 toWLn in common, and may be in an equipotential state. Alternatively, evenwhen the gate electrodes of the memory cells MC are disposed the samedistance from the common source lines CSL, gate electrodes disposed indifferent rows or columns may be controlled independently.

The ground selection transistor GST may be controlled by a groundselection line GSL, and may be connected to the common source line CSL.The string selection transistor SST may be controlled by stringselection lines SSL1 and SSL2, and may be connected to the bit lines BL0to BL2. FIG. 2 illustrates the example in which a single groundselection transistor GST and two string selection transistors SST1 andSST2 are connected to each of the plurality of memory cells MC connectedto each other in series, but an example embodiment thereof is notlimited thereto. A single string selection transistor SST1 and SST2 maybe connected to each of the plurality of memory cells MC, or a pluralityof ground selection transistors GST may be connected to the plurality ofmemory cells MC. One or more dummy lines DWL or buffer lines may bedisposed between a highest word line WLn among the word lines WL0 to WLnand string selection lines SSL1 and SSL2. In the example embodiment, oneor more dummy lines DWL may be also disposed between a lowest word lineWLn and the ground selection line GSL.

Once a signal is applied to the string selection transistors SST1 andSST2 via the string selection lines SSL1 and SSL2, a signal applied viathe bit lines BL0 to BL2 may be transferred to the memory cells MCconnected to each other in series, and an operation of reading out dataand an operation of writing data may be performed accordingly. Also, byapplying an erasing voltage through a substrate, an operation of erasingdata recorded in the memory cells MC may be performed. In an exampleembodiment, the memory cell array 2 may include at least one dummymemory cell string electrically isolated from the bit lines BL0 to BL2.

FIG. 3 is a schematic plan diagram illustrating a semiconductor deviceaccording to an example embodiment. FIG. 4 is a cross-sectional diagramtaken along line I-I′ in FIG. 3. FIG. 5 is a cross-sectional diagramillustrating region “A” in FIG. 4 in magnified form. FIG. 6 is a diagramillustrating a channel structure (CHS) in FIG. 4. FIG. 7 is across-sectional diagram taken along line in FIG. 3. FIG. 8 is across-sectional taken along line in FIG. 3.

Referring to FIGS. 3 to 6, a semiconductor device 100 may include alower substrate 10, and upper substrates 110 disposed on the lowersubstrate 10. A peripheral circuit region PERI may be disposed on thelower substrate 10, and memory cell regions CELL may be disposed on theupper substrates 110.

The peripheral circuit region PERI may include the lower substrate 10,circuit devices 20 disposed on the lower substrate 10, a lowerinterlayer insulating layer 50 covering the circuit devices 20, and alower wiring structure 30.

The lower substrate 10 may have a top surface extending in an Xdirection and a Y direction. The lower substrate 10 may include asemiconductor material, such as a group IV semiconductor, a group III-Vcompound semiconductor, or a group II-VI compound semiconductor. Forexample, the group IV semiconductor may include silicon, germanium, orsilicon-germanium. The lower substrate 10 may be provided as a bulkwafer or an epitaxial layer. The lower substrate 10 may include a wellregion including impurities and device isolation regions.

The circuit devices 20 may include a circuit gate dielectric layer 23, acircuit gate electrode layer 25, and a source/drain region 21. Thecircuit gate dielectric layer 23 may include, for example, siliconoxide, an insulating material with a high dielectric constant, orcompounds thereof. The insulating material with a high dielectricconstant may have a dielectric constant higher than a dielectricconstant of silicon oxide. The circuit gate electrode layer 25 mayinclude a conductive material such as a metal, polycrystalline siliconand metal silicide. The source/drain region 21 may be doped with n-typeimpurities or p-type impurities. A spacer disposed on both side walls ofthe circuit gate electrode layer 25 may be further included, and thespacer may be formed of silicon nitride, for example.

The lower interlayer insulating layer 50 may cover the lower substrate10, and the circuit devices 20 on the lower substrate 10, and may bedisposed between the lower substrate 10 and the upper substrates 110.The lower interlayer insulating layer 50 may be formed of an insulatingmaterial.

The lower wiring structure 30 may include a first lower contact plug 31,a first lower wiring line 32, a second lower contact plug 33, a secondlower wiring line 34, a third lower contact plug 35, and a third lowerwiring line 36, sequentially stacked from the source/drain region 21.The number of wiring lines forming the lower wiring structure 30 mayvary in example embodiments. The lower wiring structure 30 may include ametal, such as tungsten (W), copper (Cu), aluminum (Al), and the like,for example.

The memory cell region CELL may include the upper substrate 110, gateelectrode layers 131 spaced apart from each other and vertically stackedon a top surface of the upper substrate 110, mold insulating layers 114alternately stacked with the gate electrode layers 131, channelstructures CHS and dummy structures DCS disposed to penetrate throughthe gate electrode layers 131, first to seventh upper interlayerinsulating layers 120, 121, 122, 123, 124, 125, and 126 covering thegate electrode layers 131, first and second gate contact plugs 171 and175 connected to the gate electrode layers 131, first contact studs 174connected to the first gate contact plugs 171, channel contact studs 176connected to the channel structures CHS, and through plugs 172 connectedto the lower wiring structure 30. The gate electrode layers 131 and themold insulating layers 114 alternately stacked may form a gate stackstructure GS. As described herein, contact plugs are continuouslyformed, integral pillar-shaped structures (e.g., extending verticallyand formed of a continuous material). The contact plugs described hereinextend upward from an internal conductive line (e.g., a word line orgate electrode layer 131, or a wiring line). Thus, the contact plugshave a bottom termination portion that contacts an internal conductiveline. The contact plugs described herein that pass through insulatinglayers of the cell region CELL pass through at least two interlayerinsulating layers. The conductive plugs that extend upward from padregions P of gate electrode layers 131 extend continuously upward beyonda top-most gate electrode layer 131, and may extend further beyond atop-most mold insulating layer 114 and beyond at least one of upperinterlayer insulating layers 121 and 122. Components that extend upwardvertically from another vertical structure such as a channel structureCHS, a contact plug, or another contact stud which may be integrallyformed with a upper wiring, are referred to herein as contact studs.Therefore, contact studs have a bottom termination portion that does notcontact an internal word line, gate electrode layer, or wiring line.Also, within the cell region CELL, contact studs described herein may beformed above the first upper interlayer insulating layer 120.

The upper substrate 110 may have top surfaces extending in an Xdirection and a Y direction. The upper substrate 110 may have a sizesmaller than a size of the lower substrate 10. The upper substrate 110may include a semiconductor material, such as a group IV semiconductor,for example. The upper substrate 110 may be formed as a polycrystallinesilicon layer, for example, but embodiments of the upper substrate 110are not limited thereto. The upper substrate 110 and the lower substrate10 may be formed of a different material in relation to each other, orof a different crystalline structure. The lower substrate 10 may includeat least one well region including impurities. For example, an entireregion of the lower substrate 10 may be a single p-well region.

The gate electrode layers 131 may be spaced apart from each other andvertically stacked on the upper substrates 110, and may extend bydifferent lengths in at least one direction, in an X direction, forexample. An uppermost gate electrode layer 131 may have the shortestlength, and a lowermost gate electrode layer 131 may have the longestlength. In some embodiments, the further the gate electrode layer 131 isdisposed from the upper substrate 110, the shorter the length of thegate electrode layer 131. The gate electrode layers 131 may provide padregions P forming a staircase structure in a connection region CTR. Thegate electrode layers 131 may be a ground selection line of groundselection transistors, a word line of memory cells, and a stringselection line of string selection transistors in the semiconductordevice 100, respectively. For example, the lowermost gate electrodelayer 131 may be a ground selection line, and the uppermost gateelectrode layer 131 may be a string selection line. The rest of the gateelectrode layers 131, other than the uppermost and lowermost gateelectrode layers 131, may be word lines. The number of the gateelectrode layers 131 may vary depending on data storage capacity of thesemiconductor device 100. The gate electrode layers 131 may include aconductive layer formed of a metal material (e.g., tungsten (W)), forexample. In an example embodiment, the gate electrode layers 131 mayinclude a conductive layer formed of polycrystalline silicon or metalsilicide. In an example embodiment, the gate electrode layers 131 mayfurther include a barrier layer encapsulating the conductive layer. Thebarrier layer may include tungsten nitride (WN), tantalum nitride (TaN),titanium nitride (TiN), or compounds thereof, for example.

The mold insulating layers 114 may be disposed between the gateelectrode layers 131. The mold insulating layers 114 may be spaced apartfrom each other in a Z direction, perpendicular to a top surface of theupper substrates 110, and may extend by different lengths in an Xdirection similarly to the gate electrode layers 131. The moldinsulating layers 114 may include an insulating material such as siliconoxide or silicon nitride.

The channel structures CHS may be spaced apart from each other and formcolumns and rows on the upper substrate 110 in a cell array region CAR.The channel structures CHS may be disposed in a grid pattern, ordisposed in zigzag lines in one direction, on an X-Y planar surface. Thechannel structures CHS may have a columnar shape, and may have aninclined side surface. The channel structures CHS may have a diameter ora width narrowing towards the upper substrate 110. The dummy structuresDCS may be disposed in a straight line to overlap with a stringseparation insulating layer 117 in a cell array region CAR. The dummystructures DCS may be disposed adjacently to the gate contact plugs 171and 175 in the connection region CTR as well. The dummy structures DCSdisposed in the connection region CTR may penetrate through at least onegate electrode layer 131. The dummy structures DCS may have a structurethat is same as or similar to a structure of the channel structures CHS.The dummy structures DCS may be ineffective in storing data, or maystore data that is ignored by a memory controller. For example, in someembodiments, in contrast to the channel structures CHS which connects tobit lines, the dummy structures DCS may not connect to bit lines. Or, insome embodiments, even if dummy structures DCS are connected to bitlines, any data stored in the dummy structures DCS is ignored or notused by a memory controller. The dummy structures DCS may alternativelybe referred to as dummy channel structures, while non-dummy, channelstructures CHS may be referred to as working channel structures.

The channel structures CHS will be described in greater detail withreference to FIG. 6. Each of the channel structures CHS may include anepitaxial layer 151, a gate dielectric layer 161, a channel region 163,a channel insulating layer 165, and a channel pad 167. The channelregion 163 may be configured to encapsulate the internally disposedchannel insulating layer 165. In other words, the channel insulatinglayer 165 may fill an internal space of the channel region 163. In anexample embodiment, the channel region 163 may have a columnar shapesuch as a cylinder or a prism. The epitaxial layer 151 may be disposedbetween the channel region 163 and the upper substrate 110 in lowerportions of the channel structures CHS. The epitaxial layer 151 may bedisposed at least in part in a recessed area of the upper substrate 110.The epitaxial layer 151 may contact a lower end of the channel region163 and electrically connected to the channel region 163. As usedherein, the term “contact” refers to a direct physical connection (e.g.,touching). A height of a top surface of the epitaxial layer 151 may behigher than a height of a top surface of the lowermost gate electrodelayer 131, and may be lower than a height of a bottom surface of thegate electrode layer 131 disposed immediately above the lowermost gateelectrode layer 131. In an example embodiment, the epitaxial layer 151may be omitted, and in this case, the channel region 163 may directlycontact the upper substrate 110 in order to be electrically connected tothe upper substrate 110. The channel pads 167 may contact an upper endof the channel region 163 and may be electrically connected to thechannel region 163. The channel insulating layer 165 may include, forexample, silicon oxide. The epitaxial layer 151 and the channel region163 may include a semiconductor material such as polycrystalline siliconor single crystal silicon. The semiconductor material may be a non-dopedmaterial, or may be doped with p-type impurities or n-type impurities.The channel pads 167 may include doped polycrystalline silicon, forexample. The gate dielectric layer 161 may be disposed between the gateelectrode layers 131 and the channel region 163. The gate dielectriclayer 161 may encapsulate the channel region 163. The gate dielectriclayer 161 may include a tunneling layer 161 a, an electric chargestoring layer 161 b, and a blocking layer 161 c, sequentially stackedfrom the channel region 163. The tunneling layer 161 a may includesilicon oxide (SiO₂), silicon nitride (Si₃N₄), silicon oxynitride(SiON), or compounds thereof, for example. The electric charge storinglayer 161 b may be an electric charge trap layer or a floatingconductive layer. The electric charge trap layer may include siliconnitride. The floating conductive layer may include polycrystallinesilicon. The blocking layer 161c may include silicon oxide (SiO₂),silicon nitride (Si₃N₄), silicon oxynitride (SiON), a high-k dielectricmaterial, or compounds thereof.

An epi-insulating layer 155 may be disposed between the epitaxial layer151 and the lowermost gate electrode layer 131. The epi-insulating layer155 may have a ring shape surrounding the epitaxial layer 151.

A first upper interlayer insulating layer 120 may be disposed to coverthe upper substrate 110 and the gate electrode layers 131 on the uppersubstrate 110. A top surface of the first upper interlayer insulatinglayer 120 may be coplanar with a top surface of an uppermost moldinsulating layer 114. Second to seventh upper interlayer insulatinglayers 121, 122, 123, 124, 125, and 126 may be stacked on the uppermostmold insulating layer 114 and the first upper interlayer insulatinglayer 120. The first to seventh upper interlayer insulating layers 120,121, 122, 123, 124, 125, and 126 may include silicon oxide or a low-kdielectric material.

Terms such as “same,” “equal,” “planar,” or “coplanar,” as used hereinwhen referring to orientation, layout, location, shapes, sizes, amounts,or other measures do not necessarily mean an exactly identicalorientation, layout, location, shape, size, amount, or other measure,but are intended to encompass nearly identical orientation, layout,location, shapes, sizes, amounts, or other measures within acceptablevariations that may occur, for example, due to manufacturing processes.The term “substantially” may be used herein to emphasize this meaning,unless the context or other statements indicate otherwise. For example,items described as “substantially the same,” “substantially equal,” or“substantially planar,” may be exactly the same, equal, or planar, ormay be the same, equal, or planar within acceptable variations that mayoccur, for example, due to manufacturing processes.

The memory cell regions CELL in the semiconductor device 100 may furtherinclude a through region 145 penetrating through the gate electrodelayers 131, the mold insulating layers 114, and the upper substrate 110and extending to an upper portion of the lower interlayer insulatinglayer 50 in the connection region CTR. A height of a bottom surface ofthe through region 145 may be lower than a height of a bottom surface ofthe upper substrate 110, or may be at the same height as a bottomsurface of the upper substrate 110. The through region 145 may have aninclined side wall (not shown), and have a width narrowing toward alower portion. For example, a width of a bottom surface of the throughregion 145 may be narrower than a width of a top surface thereof, and awidth of an upper portion of the through region 145 may be greater thana width of a lower portion thereof. The through region may pass througha portion of the stack of gate electrode layers 131 and mold insulatinglayers 114 to be surrounded on its sidewall surfaces by side surfaces ofthe gate electrode layers 131 and mold insulating layers 114. Thethrough region 145 may also be described as a through structure, whichincludes a vertical insulating structure.

The through region 145 may include an insulating material, and thethrough plugs 172 may penetrate through the through region 145 and maybe connected to the lower wiring structure 30. The through plugs 172 mayalso be disposed in a core region CCR adjacent to the connection regionCTR, and may penetrate through the first upper interlayer insulatinglayer 120 and may be connected to a lower wiring structure 30. Thethrough plugs 172 may be electrically connected to circuit devices 20through the lower wiring structure 30. The through plugs 172 may alsopenetrate through the second and third upper interlayer insulatinglayers 121 and 122 covering the through region 145.

The gate contact plugs 171 and 175 may be connected to pad regions Pprovided by the gate electrode layers 131. Some of the plurality of gateelectrode layers 131, disposed in an upper portion, may be referred toas upper gate electrode layers 131, and the gate electrode layers 131below the upper gate electrode layers 131 may be referred to as lowergate electrode layers 131. The plurality of gate electrode layers 131may include the lower gate electrode layers 131 disposed adjacently tothe upper substrate 110, and the upper gate electrode layers 131disposed on the lower gate electrode layers 131. The first gate contactplugs 171 may penetrate through the first, second, and third upperinterlayer insulating layers 120, 121, and 122 and may contact the padregions P of the lower gate electrode layers 131. The second gatecontact plugs 175 may penetrate through the first to fourth upperinterlayer insulating layers 120, 121, 122, and 123 and may contact theupper gate electrode layers 131. The first gate contact plugs 171 may bereferred to as lower contact plugs, and the second gate contact plugs175 may be referred to as upper contact plugs. A top or top surface ofthe second gate contact plugs 175 (e.g., where it meets first upperwirings 178) may have a height higher than a height a top of the firstgate contact plugs 171. The top or top surface of the second gatecontact plugs 175 may have a height higher than a height of top surfacesof the through plugs 172.

The first contact studs 174 may penetrate through the fourth upperinterlayer insulating layer 123 and may contact upper ends and an uppersurface of the first gate contact plugs 171. The channel contact studs176 may penetrate through the second to fifth upper interlayerinsulating layers 121, 122, 123, and 124 and may contact upper portionsof the channel structures CHS. The channel contact studs 176 may contactthe channel pads 167 of the channel structures CHS. Top surfaces of thechannel contact studs 176 may be disposed at a height higher than aheight of top surfaces of the first contact studs 174 (e.g., higher thana top-most portion of the first contact studs 174 where they meet thefirst upper wirings 178). Top surfaces of the channel contact studs 176may be disposed at a height higher than top surfaces of the second gatecontact plugs 175 (e.g., higher than a top-most portion of the secondgate contact plugs 175 where they meet the first upper wirings 178). Topsurfaces of the channel contact studs 176 may be disposed at a heightequal to top surfaces of first upper wirings 178.

The first upper wirings 178 may include a conductive material, describedas metal wires, disposed on the first contact studs 174 and the secondcontact plugs 175. Thus, first metal wires may be respectively disposedon the first contact studs 174, and second metal wires may berespectively disposed on the second contact plugs 175. The first upperwirings 178 may penetrate through the fifth interlayer insulating layer124 and may be directly connected to the first contact studs 174 and thesecond contact plugs 175. Through a dual damascene process, some of thefirst upper wirings 178 may respectively be integrated with the firstcontact studs 174 (e.g., to form a continuous, integral structure).Also, through a dual damascene process, the other first upper wirings178 may respectively be integrated with the second gate contact plugs175. On the first upper wirings 178, second contact studs 191penetrating through the sixth upper interlayer insulating layer 125 andconnected to the first upper wirings 178 may be disposed. On the secondcontact studs 191, second upper wirings 197 penetrating through theseventh upper interlayer insulating layer 126 may be disposed. At leastsome of the second upper wirings 197 may be connected to the secondcontact studs 191.

Referring to FIG. 5, the gate electrode layers 131 may include a gatebarrier layer 131 a and a gate conductive layer 131 b. The gate barrierlayer 131 a may encapsulate the gate conductive layer 131 b. The gatebarrier layer 131 a may be formed of a conductive metal nitride, such astungsten nitride (WN), tantalum nitride (TaN), titanium nitride (TiN),or compounds thereof. The gate conductive layer 131 b may be formed of ametal material, such as tungsten, for example. The first gate contactplugs 171 may include a first gate contact barrier layer 171 a and afirst gate contact conductive layer 171 b, and a bottom surface and aside surface of the first gate contact conductive layer 171 b may beencapsulated by the first gate contact barrier layer 171 a. The firstgate contact barrier layer 171 a may have a structure in which titanium(Ti) and titanium nitride (TiN) are stacked, for example. The first gatecontact conductive layer 171 b may be formed of a metal material, suchas tungsten, for example. The first upper wiring 178 may be disposed onthe second gate contact plugs 175, and the second gate contact plugs 175and the first upper wire 178 may be integrated with each other through adual damascene process. The second gate contact plugs 175 may include asecond gate contact barrier layer 175 a and a second gate contactconductive layer 175 b, and a bottom surface and a side surface of thesecond gate contact conductive layer 175 b may be encapsulated by thesecond gate contact barrier layer 175 a. The first upper wiring 178 mayinclude a first upper wiring barrier layer 178 a and a first upperwiring conductive layer 178 b, a portion of a bottom surface and a sidesurface of the first upper wiring conductive layer 178 b may beencapsulated by the first upper wiring barrier layer 178 a. The secondgate contact conductive layer 175 b and the first upper wiringconductive layer 178 b may be integrated with each other through asingle deposition process. The second gate contact barrier layer 175 aand the first upper wiring barrier layer 178 a may be integrated witheach other through a single deposition process.

The first upper wiring 178 may be disposed on the first contact stud174, and the first contact stud 174 and the first upper wiring 178 maybe integrated with each other through a dual damascene process. Thefirst contact stud 174 may include a first contact stud barrier layer174 a and a first contact stud conductive layer 174 b, and a bottomsurface and a side surface of the first contact stud conductive layer174 b may be encapsulated by the first contact stud barrier layer 174 a.The first upper wiring 178 may include the first upper wiring barrierlayer 178 a and the first upper wiring conductive layer 178 b, and aportion of a bottom surface and a side surface of the first upper wiringconductive layer 178 b may be encapsulated by the first upper wiringbarrier layer 178 a. The first contact stud conductive layer 174 b andthe first upper wiring conductive layer 178 b may be integrated witheach other through a single deposition process. The first contact studbarrier layer 174 a and the first upper wiring barrier layer 178 a maybe integrated with each other through a single deposition process.

The first gate contact plugs 171 and the second gate contact plugs 175may be inserted into the pad region P of the gate electrode layers 131.

The semiconductor device 100 may further include separation regions SRdividing the gate electrode layers 131 in the memory cell regions CELLinto a plurality of regions spaced apart from each other in a Ydirection, and extending in an X direction. The separation region SR mayinclude a conductive layer 180 and an insulating layer 182, and theconductive layer 180 may be a common source line. The conductive layer180 may be electrically insulated from the gate electrode layers 131 bythe insulating layer 182. The separation regions SR may be connected toimpurity regions 108 disposed in an upper portion of the upper substrate110. In the memory cell regions CELL, the string separation insulatinglayer 117 dividing the uppermost gate electrode layer 131 disposedbetween the separation regions SR into two regions spaced apart fromeach other, and extending in an X direction may be disposed. The stringseparation insulating layer 117 may include an insulating material suchas silicon oxide. An auxiliary separation regions SR′ may be disposedbetween the separation regions SR. The auxiliary separation regions SR′may be spaced apart from the string separation insulating layer 117 inan X direction, and may be disposed in a straight line. The auxiliaryseparation regions SR′ may extend by a length shorter than a length ofthe separation regions SR in an X direction. The auxiliary separationregions SR′ may have the same structure as a structure of the separationregions SR, and may be connected to the upper substrate 110.

FIG. 9 is a cross-sectional diagram illustrating a pad region of asemiconductor device according to an example embodiment.

Referring to FIG. 9, pad regions P of the gate electrode layers 131 mayhave a thickness greater than thicknesses of the other regions of thegate electrode layers 131. The pad regions P may prevent a punchingdefect in which gate contact holes penetrate through the pad regions Pduring a process of etching the gate contact holes.

FIG. 10 is a schematic cross-sectional diagram illustrating asemiconductor device, corresponding to FIG. 4, according to an exampleembodiment. FIG. 11 is a cross-sectional diagram illustrating region “A”in FIG. 10 in magnified form. In the semiconductor device in FIGS. 3 to8, the first upper wirings 178 and the first contact studs 174 may beintegrated with each other, and the first upper wirings 178 and secondgate contact plugs 175 may be integrated with each other, through adamascene process. Differently from the semiconductor device in FIGS. 3to 8, in a semiconductor device in FIGS. 10 and 11, first contact studs174′, second gate contact plugs 175′, and channel contact studs 176′ maybe formed through a single damascene process, and then first upperwirings 178′ may be formed through a single damascene process. Thesemiconductor device in FIGS. 10 and 11 may be similar to thesemiconductor device in FIGS. 3 to 8, and thus, overlapping descriptionswill not be repeated.

Referring to FIG. 10, top surfaces of the channel contact studs 176′ maybe disposed at a height equal to a height of top surfaces of the firstcontact studs 174′. Top surfaces of the channel contact studs 176′ maybe disposed at the same height as a height of top surfaces of the secondgate contact plugs 175′.

Referring to FIG. 11, the second gate contact plugs 175′ may include asecond gate contact barrier layer 175 a′ and a second gate contactconductive layer 175 b′, and a bottom surface and a side surface of thesecond gate contact conductive layer 175 b′ may be encapsulated by thesecond gate contact barrier layer 175 a′. The first upper wirings 178′may include the first upper wiring barrier layer 178 a′ and the firstupper wiring conductive layer 178 b′, and a bottom surface and a sidesurface of the first upper wiring conductive layer 178 b′ may beencapsulated by the first upper wiring barrier layer 178 a′. The secondgate contact conductive layer 175 b 40 may contact the first upperwiring barrier layer 178 a′. The first contact studs 174′ may include afirst contact stud barrier layer 174 a′ and a first contact studconductive layer 174 b′, and a bottom surface and a side surface of thefirst contact stud conductive layer 174 b′ may be encapsulated by thefirst contact stud barrier layer 174 a′. The first contact studconductive layer 174 b′ may contact the first upper wiring barrier layer178 a′.

FIG. 12 is a schematic cross-sectional diagram illustrating asemiconductor device, corresponding to FIG. 7, according to an exampleembodiment.

In the semiconductor device in FIG. 12, differently from thesemiconductor device in FIGS. 3 to 8, a structure of dummy structuresDCS′ may be different from a structure of channel structures CHS. Anupper substrate 110 may include an insulating layer 105, and the dummystructures DCS′ may be disposed on the insulating layer 105. The channelstructures CHS may be electrically connected to the upper substrate 110,and the dummy structures DCS′ may be electrically insulated from thesubstrate 110. The dummy structures DCS′ may thus be electricallyfloated. The dummy structures DCS′ may not include an epitaxial layer151, differently from the channel structures CHS.

FIG. 13 is a schematic cross-sectional diagram illustrating asemiconductor device according to an example embodiment.

Referring to FIG. 13, the semiconductor device may include a first gatestack structure GS1 and a second gate stack structure GS2, sequentiallystacked on an upper substrate 110. The first gate stack structure GS1and the second gate stack structure GS2 may include alternately disposedmold insulating layers 114 and gate electrode layers 131. Channelstructures CHS′ may penetrate through the first and second gate stackstructures GS1 and GS2 and may contact the upper substrate 110. Thechannel structures CHS′ may have a width abruptly changing at a boundarybetween the first gate stack structure GS1 and the second gate stackstructure GS2. The channel structures CHS′ may include a region having awidth decreasing towards the upper substrate 110, which width thenabruptly increases. A width of the channel structures CHS′ may decreasetowards the upper substrate 110 and abruptly increase at a boundarybetween the first gate stack structure GS1 and the second gate stackstructure GS2, and may decrease again.

FIG. 14 is a schematic cross-sectional diagram illustrating asemiconductor device according to an example embodiment. FIG. 15 is across-sectional diagram illustrating region “B” in FIG. 14 in magnifiedform. The semiconductor device in FIGS. 14 and 15 may be similar to thesemiconductor device in FIG. 13, but shapes of some of first gatecontact plugs 171′ may be different.

Some of the first gate contact plugs 171′ contacting gate electrodelayers 131 in a first gate stack structure GS1 may include a regionhaving a width decreasing towards an upper substrate 110, which widththen abruptly increases. Some of the first gate contact plugs 171′contacting the gate electrode layers 131 in the first gate stackstructure GS1 may have a width decreasing toward the upper substratewhich abruptly increases at a boundary between the first gate stackstructure GS1 and the second gate stack structure GS2, and decreasesagain.

Referring to FIG. 15, the first gate contact plugs 171′ may include afirst gate contact barrier layer 171 a′ and a first gate contactconductive layer 171 b′, and a bottom surface and a side surface of thefirst gate contact conductive layer 171 b′ may be encapsulated by thefirst gate contact barrier layer 171 a′. The first gate contactconductive layer 171 b′ may include a lower gate contact conductivelayer 171 l and an upper gate contact conductive layer 171 h. A boundarybetween the lower gate contact conductive layer 171 l and the upper gatecontact conductive layer 171 h may be the same as a boundary between afirst gate stack structure GS1 and a second gate stack structure GS2.The upper gate contact conductive layer 171 h may have a widthdecreasing toward the upper substrate 110, and the lower gate contactconductive layer 171 l may have a width also decreasing toward the uppersubstrate 110. A width of a lower portion of the upper gate contactconductive layer 171 h may be greater than a width of an upper portionof the lower gate contact conductive layer 171 l.

FIGS. 16 to 20 are schematic cross-sectional diagrams illustrating amethod of manufacturing a semiconductor device according to an exampleembodiment. In FIGS. 16 to 20, a region corresponding to FIG. 4 isillustrated.

Referring to FIG. 16, circuit devices 20 and lower wiring structures 30may be disposed on an upper substrate 10.

A circuit gate dielectric layer 23 and a circuit gate electrode layer 25may be formed on a lower substrate 10. Thereafter, source/drain regions21 may be formed on both side portions of the circuit gate electrodelayer 25.

The lower wiring structures 30 and a lower interlayer insulating layer50 may be formed on the lower substrate 10. The lower wiring structures30 may include a first lower contact plug 31, a first lower wiring line32, a second lower contact plug 33, and a second lower wiring line 34,and a third lower contact plug 35, and a third lower wiring line 36. Thelower interlayer insulating layer 50 may be formed of a plurality ofinsulating layers.

An upper substrate 110 may be formed on the lower interlayer insulatinglayer 50. The upper substrate 110 may be formed of polycrystallinesilicon, for example. The upper substrate 110 may include, for example,p-type impurities. The upper substrate 110 may have a size smaller thana size of the lower substrate 10.

Mold insulating layers 114 and sacrificial layers 116 may be alternatelystacked on the upper substrate 110, and the sacrificial layers 116 andthe mold insulating layers 114 may be partially removed by repeatedlyperforming a photolithography process and an etching process to extendthe sacrificial layers 116 and the mold insulating layers 114 bydifferent lengths in an X direction. Accordingly, the sacrificial layers116 and the mold insulating layers 114 may form a staircase structure.

The sacrificial layers 116 may be replaced with gate electrode layers131 through a subsequent process. The sacrificial layers 116 may beformed of a material that has etch selectivity in relation to a materialformed of the mold insulating layers 114. For example, the moldinsulating layers 114 may be formed of at least one material from amongsilicon oxide and silicon nitride, and the sacrificial layers 116 may beformed of a material from among silicon, silicon oxide, silicon carbide,and silicon nitride, and a material of the sacrificial layers 116 may bedifferent from the selected material of the mold insulating layers 114.Some of the mold insulating layers 114 may have thicknesses differentfrom thicknesses of the other mold insulating layers 114.

Thereafter, a first upper interlayer insulating layer 120 covering astack structure of the sacrificial layers 116 and the mold insulatinglayers 114 and the upper substrate 110 may be formed. A top surface ofthe first upper interlayer insulating layer 120 may be coplanar with atop surface of an uppermost mold insulating layer 114 through aplanarization process.

Referring to FIG. 17, a through region 145 penetrating through a stackstructure of sacrificial layers 116 and mold insulating layers 114 andan upper substrate 110 may be formed.

An opening OP penetrating through the stack structure of the sacrificiallayers 116 and the mold insulating layers 114 and exposing a lowerinterlayer insulating layer 50 may be formed by an anisotropic etchingprocess, and the through region 145 may be formed by filling the openingOP with an insulating material. A top surface of the through region 145may be coplanar with a top surface of a first upper interlayerinsulating layer 120.

Channel holes CHH penetrating through the stack structure of thesacrificial layers 116 and the mold insulating layers 114 and exposingthe upper substrate 110 may be formed. The channel holes CHH may have ahole shape having a high aspect ratio, and may be formed by ananisotropic etching process. Due to a height of the stack structure,side walls of the channel holes CHH may not be perpendicular to a topsurface of the upper substrate 110.

Channel structures CHS may be formed by forming an epitaxial layer 151,a gate dielectric layer 161, a channel region 163, a channel insulatinglayer 165, and a channel pad 167 in the channel holes CHH. The epitaxiallayer 151 may be formed using a selective epitaxial growth (SEG)process. The epitaxial layer 151 may be formed of a single layer or aplurality of layers. The epitaxial layer 151 may include polycrystallinesilicon, single crystal silicon, polycrystalline germanium, or singlecrystal germanium, in which impurities are doped or not doped. The gatedielectric layers 161 may have equal thicknesses through an ALD processor a CVD process. The channel region 163 may be formed on the gatedielectric layer 161 in the channel holes CHH, and a lower portion ofthe channel region 163 may penetrate through the gate dielectric layer161 and may be connected to the epitaxial layer 151. The channelinsulating layer 165 may fill an internal space of the channel area 163,and may be formed of an insulating material. Depending on exampleembodiments, the internal space of the channel area 163 may be filledwith a conductive material, rather than the channel insulating layer165. A channel pad 167 may be formed of a conductive material, such asdoped polycrystalline silicon, for example.

Referring to FIG. 18, openings dividing a stack structure of moldinsulating layers 114 and sacrificial layers 116 into a plurality ofregions may be formed, and only the sacrificial layers 116 exposedthrough the openings may be removed by a wet etching process. The spacein which the sacrificial layers 116 are removed may be filled with aconductive material to form gate electrode layers 131. Before filing thespace in which the sacrificial layers 116 are removed with a conductivematerial, an oxidation process may be undertaken to form anepi-insulating layer 155 on a side wall of an epitaxial layer 151.

Before forming the openings, a second upper interlayer insulating layer121 covering the mold insulating layers 114, channel structures CHS, athrough region 145, and a first upper interlayer insulating layer 120may be formed.

Although not illustrated, a common source region 108 may be formed byinjecting impurities into an upper substrate 110 exposed through theopening, and an insulating layer 182 and a conductive layer 180 may beformed in the opening (see FIG. 8).

A third upper interlayer insulating layer 122 covering the second upperinterlayer insulating layer 121 may be formed, and first gate contactplugs 171 connected to the gate electrode layers 131 other than the gateelectrode layers 131 disposed in an upper portion among the plurality ofgate electrode layers 131 may be formed. The gate electrode layers 131disposed in an upper portion among the plurality of gate electrodelayers 131 may be referred to as upper gate electrode layers 131, andthe other gate electrode layers 131 may be referred to as lower gateelectrode layers 131.

First gate contact holes penetrating through the first to third upperinterlayer insulating layers 120, 121, and 122 and exposing the lowergate electrode layers 131 may be formed through an anisotropic etchingprocess. The first gate contact plugs 171 may be formed by formingbarrier layers in the first gate contact holes and filling the firstgate contact holes with a conductive layer. Through plugs 172penetrating through the through region 145, and the second and thirdupper interlayer insulating layers 121 and 122 or penetrating the firstto third upper interlayer insulating layers 120, 121, and 122 andconnected to a lower wiring structure 30 may be formed. The throughplugs 172 may include conductive layers, and barrier layers coveringbottom surfaces and side surfaces of the conductive layers.

When the gate contact holes having different depths, which expose padregions P of the plurality of gate electrode layers 131, are etched, apunching defect in which some of the gate contact holes penetratethrough the pad regions may occur. The higher the number of layers ofthe plurality of gate electrode layers 131, the more difficult it may beto prevent a punching defect by simply improving an etch selectivity ofan anisotropic etching process for forming the gate contact holes.

In an example embodiments, by forming the contact holes exposing the padregions P of the gate electrode layers 131 other than the gate electrodelayers 131 disposed in an upper portion among the plurality of gateelectrode layers 131, a punching defect in which the contact holespenetrate through the gate electrode layers 131 may be prevented.

Referring to FIG. 19, fourth and fifth upper interlayer insulatinglayers 123 and 124 may be formed on a third upper interlayer insulatinglayer 122. First contact holes H1, second contact holes H2, thirdcontact holes H3 may be formed through an anisotropic etching process.The first contact holes H1 may penetrate through the fourth and fifthupper interlayer insulating layers 123 and 124 and expose first gatecontact plugs 171 and through plugs 172. The second contact holes H2 maypenetrate through the first to fifth upper interlayer insulating layers120, 121, 122, 123, and 124 and expose upper gate electrode layers 131.The second contact holes H2 may be second gate contact holes. The thirdcontact holes H3 may penetrate through the second to fifth upperinterlayer insulating layers 121, 122, 123, and 124 and expose channelstructures CHS. Wiring trenches T may be formed by an additionalanisotropic etching process. The wiring trenches T may be formed in alocation of overlap between the fifth upper interlayer insulating layer124 and the first and second contact holes H1 and H2 by etching thefifth upper interlayer insulating layer 124. The wiring trenches T maybe connected to the first and second contact holes H1 and H2 disposedbelow the wiring trenches T.

Referring to FIG. 20, first contact studs 174, second gate contact plugs175, channel contact studs 176, and first upper wirings 178 may beformed by forming barrier layers in wiring trenches T, first contactholes H1, second contact holes H2, and third contact holes H3, andfilling the wiring trenches T, the first contact holes H1, the secondcontact holes H2, and the third contact holes H3 with a conductive layerthrough a dual damascene process.

The first upper wirings 178 may respectively be disposed on the firstcontact studs 174 and the second gate contact plugs 175. Some of thefirst upper wirings 178 may respectively be integrated with the firstcontact studs 174. The other first upper wirings 178 may be respectivelyintegrated with the second gate contact plugs 175. Though not shown, thewirings may extend in the Y direction and may connect to other wiringsor conductive lines.

It should be noted that although the terms first, second, third etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. Unless the contextindicates otherwise, these terms are only used to distinguish oneelement, component, region, layer or section from another element,component, region, layer or section, for example as a naming convention.Thus, a first element, component, region, layer or section discussedbelow in one section of the specification could be termed a secondelement, component, region, layer or section in another section of thespecification or in the claims without departing from the teachings ofthe present invention. In addition, in certain cases, even if a term isnot described using “first,” “second,” etc., in the specification, itmay still be referred to as “first” or “second” in a claim in order todistinguish different claimed elements from each other.

According to the aforementioned example embodiments, by replacing someof the gate contact plugs connected to the gate electrode layers withthe contact studs formed on the gate contact plugs in the memory cellregion, a vertical-type memory device in which a punching defect isresolved may be provided.

While the example embodiments have been shown and described above, itwill be apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

1. A vertical-type memory device, comprising: a plurality of gateelectrode layers spaced apart from one another and stacked on asubstrate, and extending by different lengths in a first direction andforming a staircase structure; a first interlayer insulating layercovering the staircase structure of the plurality of gate electrodelayers; and a plurality of gate contact plugs penetrating the firstinterlayer insulating layer and respectively contacting the gateelectrode layers, wherein the plurality of gate electrode layerscomprise lower gate electrode layers disposed adjacently to thesubstrate, and upper gate electrode layers disposed on the lower gateelectrode layers so that the lower gate electrode layers are between thesubstrate and the upper gate electrode layers, and wherein the pluralityof gate contact plugs comprise lower gate contact plugs connected to thelower gate electrode layers, and upper gate contact plugs connected tothe upper gate electrode layers, wherein the upper gate contact plugshave top-most portions disposed at a height higher than a height of topsurfaces of the lower gate contact plugs.
 2. The vertical-type memorydevice of claim 1, wherein: the lower gate contact plugs are eachintegrally formed of a continuous material to extend from a respectivelower gate electrode layer to a height above a top surface of the firstinterlayer insulating layer; and the upper gate contact plugs are eachintegrally formed of a continuous material to extend from a respectiveupper gate electrode layer to a height above a top surface of the firstinterlayer insulating layer.
 3. The vertical-type memory device of claim2, further comprising: a plurality of contact studs respectivelydisposed on the lower gate contact plugs, wherein the top-most portionsof the upper gate contact plugs are disposed at the same height as aheight of top-most portions of the plurality of contact studs.
 4. Thevertical-type memory device of claim 3, further comprising: first metalwires respectively disposed on and directly connected to the upper gatecontact plugs and second metal wires respectively disposed on anddirectly connected to the plurality of contact studs.
 5. Thevertical-type memory device of claim 4, wherein the first metal wiresare respectively integrated with the upper gate contact plugs.
 6. Thevertical-type memory device of claim 2, wherein the plurality of gateelectrode layers forming the staircase structure have ends including padregions having thicknesses greater than thicknesses of the other regionsof the plurality of gate electrode layers, and the plurality of gatecontact plugs contact the pad regions.
 7. The vertical-type memorydevice of claim 2, further comprising: a lower wiring structure disposedbelow the substrate; and through plugs penetrating through the pluralityof gate electrode layers and contacting the lower wiring structure,wherein the top-most portions of the upper gate contact plugs aredisposed at a height higher than a height of top surfaces of the throughplugs.
 8. The vertical-type memory device of claim 2, furthercomprising: a plurality of channel structures penetrating through theplurality of gate electrode layers; and a plurality of dummy structurespenetrating through at least one of the plurality of gate electrodelayers, and disposed adjacently to the plurality of gate contact plugs.9. The vertical-type memory device of claim 8, wherein the plurality ofdummy structures have the same structure as a structure of the pluralityof channel structures, and are electrically connected to the substrate.10. The vertical-type memory device of claim 8, wherein the plurality ofchannel structures have a structure different from a structure of theplurality of dummy structures, the plurality of channel structures areelectrically connected to the substrate, and the plurality of dummystructures are insulated from the substrate. 11-12. (canceled)
 13. Avertical-type memory device, comprising: a memory cell region comprisinga plurality of gate electrode layers spaced apart from one another andvertically stacked on a substrate, and a plurality of gate contact plugsrespectively contacting the plurality of gate electrode layers, whereinthe plurality of gate contact plugs comprise a first gate contact plugcontacting a lowermost gate electrode layer among the plurality of gateelectrode layers, and a second gate contact plug contacting an uppermostgate electrode layer among the plurality of gate electrode layers, andthe first gate contact plug has a top surface having a first heightlower than a second height of a top-most portion of the second gatecontact plug, wherein the first gate contact plug is integrally formedof a continuous material to extend from the lowermost gate electrodelayer to a height above the uppermost gate electrode layer; and thesecond gate contact plug is integrally formed of a continuous materialto extend from the uppermost gate electrode layer to the second height.14. The vertical-type memory device of claim 13, further comprising: aperipheral circuit region comprising circuit devices and lower wiringstructures disposed on a lower substrate below the substrate, whereinthe memory cell region is disposed on the peripheral circuit region. 15.The vertical-type memory device of claim 13, wherein the plurality ofgate electrode layers extend by different lengths in a first directionand form a staircase structure, and further comprising: a firstinterlayer insulating layer covering the staircase structure of theplurality of gate electrode layers, wherein the first gate contact plugpenetrates the first interlayer insulating layer to contact thelowermost gate electrode layer, and the second gate contact plugpenetrates the first interlayer insulating layer to contact theuppermost gate electrode layer.
 16. The vertical-type memory device ofclaim 13, further comprising: a through region penetrating through thesubstrate and the plurality of gate electrode layers; and a through plugpenetrating through the through region and connected to a lower wiringstructure disposed on a lower substrate below the substrate, wherein thethrough plug has a top surface having a height lower than the secondheight.
 17. The vertical-type memory device of claim 13, wherein thememory cell region further comprises a contact stud disposed on thefirst gate contact plug, and the top-most portion of the second gatecontact plug is disposed at the same height as a height of a top surfaceof the contact stud.
 18. The vertical-type memory device of claim 13,wherein the plurality of gate electrode layers include pad regions andother regions, the pad regions having thicknesses greater thanthicknesses of the other regions, and for each gate electrode layerincluding the lowermost gate electrode layer and uppermost gateelectrode layer, a respective gate contact plug contacts a respectivepad region.
 19. The vertical-type memory device of claim 13, furthercomprising: a plurality of working channel structures penetratingthrough the plurality of gate electrode layers; and a plurality of dummychannel structures penetrating through at least one of the plurality ofgate electrode layers.
 20. The vertical-type memory device of claim 19,wherein the plurality of working channel structures have structuresdifferent from the plurality of dummy channel structures, the pluralityof working channel structures are electrically connected to thesubstrate, and the plurality of dummy channel structures are insulatedfrom the substrate.
 21. (canceled)
 22. The vertical-type memory deviceof claim 19, wherein the first gate contact plug comprises a regionhaving a width decreasing towards the substrate, which width thenincreases.
 23. A vertical-type memory device, comprising: a lowersubstrate; circuit devices provided on the lower substrate; a lowerinterlayer insulating layer covering the circuit devices; an uppersubstrate disposed on the lower interlayer insulating layer; a firstgate electrode layer and a second gate electrode layer spaced apart fromeach other and stacked on the upper substrate; an upper interlayerinsulating layer covering the first gate electrode layer and the secondgate electrode layer; a first gate contact plug and a second gatecontact plug penetrating through the upper interlayer insulating layerand respectively contacting the first gate electrode layer and thesecond gate electrode layer; and a through plug penetrating through thefirst and second gate electrode layers and the upper substrate andelectrically connected to the circuit devices, wherein the first gatecontact plug and the through plug have top surfaces having heights lowerthan a height of a top-most portion of the second gate contact plug.